Laser Ablation

Laser Ablation 

Removal of Thin Layers

Selective laser-ablation is applied where individual layers have to be ablated without significantly damaging the layers or substrates below. The ablation geometry can be spot or line shaped or two-dimensional.

 Applications

Examples can be found in many areas of industrial manufacturing

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• Lasers with best beam quality (TEM₀₀) and very high repetition rates of up to 200 kHz are used for the ablation of 20–50 microns wide scribe lines at process speeds of up to 2000 mm/s without damaging the glass substrate or the layers beneath.

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• Ablation of polymer layers out in a polymer-metal compound for realizing electromagnetic shielded housings. The polymer-conductor-compound is injection molded and then the pre.defined layers is ablated by a CO₂laser. The exposed metal fabrics provide conductive contact to surrounding housing parts

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Laser Machine

Laser Spare Part